Products Description of Tetramethylammonium hydroxide CAS#maleic-anhydride.html">material/tetramethylammonium-hydroxide.html">75-59-2
Tetramethylammonium hydroxide appears as a hydrated solid or a clear liquid featuring a pungent ammonia‑like smell. It dissolves readily in water and exhibits corrosive action toward metals and biological tissues.
Tetramethylammonium hydroxide Chemical Properties
| Parameter | Value |
| Melting point | °C |
| Boiling point | 110 °C |
| density | 0.866 g/mL at 25 °C |
| vapor pressure | 17.5 mm Hg (20 °C) |
| refractive index | n20/D 1.384 |
| Fp | 80 °F |
| storage temp. | Store below +30°C. |
| solubility | Methanol (Sparingly), Water (Slightly) |
| form | Solution |
| color | APHA: ≤10 |
| Odor | strong ammonia-like odor |
| PH | >13 (H2O, 20°C) |
| Water Solubility | Soluble in water. |
| Sensitive | Air Sensitive |
| Merck | 14,9224 |
| BRN | 3558708 |
| Stability: | Stable. Flammable. Incompatible with strong oxidizing agents, strong acids. |
| InChIKey | WGTYBPLFGIVFAS-UHFFFAOYSA-M |
| CAS DataBase Reference | 75-59-2(CAS DataBase Reference) |
| EPA Substance Registry System | Tetramethylammonium hydroxide (75-59-2) |
Safety Information
| Item | Details |
| Hazard Codes | C,T,F,T+,Xn |
| Risk Statements | 24/25-34-20/21/22-39/23/24/25-23/24/25-10-21/22-25-21-11-67-36-52-48/24-27/28-23-35-36/38 |
| Safety Statements | 45-36/37/39-26-16-36/37-28 |
| RIDADR | UN 3286 3/PG 2 |
| WGK Germany | 1 |
| RTECS | PA0875000 |
| F | 4.4-10-34 |
| TSCA | Yes |
| HazardClass | 3 |
| PackingGroup | II |
| HS Code | 29239000 |
| Hazardous Substances Data | 75-59-2(Hazardous Substances Data) |
Product Application of Tetramethylammonium hydroxide CAS#75-59-2
Tetramethylammonium hydroxide serves as a raw material for manufacturing tetramethylammonium azide. It acts as an anisotropic etching agent for silicon, a fundamental developer for positive photoresists in lithographic processes, a surfactant in ferrofluid production, and a supporting reagent in polarographic analysis. It is widely used in organosilicon manufacturing, as a polishing and cleaning agent for semiconductor wafers, and in the purification processes of certain metallic elements. A 25 wt.% water solution of this compound can be employed as a pH regulator to synthesize hexagonal mesoporous aluminophosphate (TAP) materials.
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